STPS1L40A/u ? july 1999 - ed: 3a low drop power schottky rectifier i f(av) 1 a v rrm 40 v tj (max) 150 c v f (max) 0.42 v main product characteristics very small conduction losses negligible switching losses low forward voltage drop surface mount miniature package features and benefits single chip schottky rectifiers suited to switched mode power supplies and high frequency dc to dc converters. packaged in sma and smb, this device is especially intended for surface mounting and used in low voltage, high frequency inverters, free wheeling and polarity protection applications. description smb (jedec do-214aa) stps1l40u symbol parameter value unit v rrm repetitive peak reverse voltage 40 v i f(rms) rms forward current 8 a i f(av) average forward current t l = 130c d = 0.5 1 a i fsm surge non repetitive forward current tp = 10 ms sinusoidal 60 a i rrm repetitive peak reverse current tp = 2 m s square f=1khz 1 a i rsm non repetitive peak reverse current tp = 100 m s square 1 a t stg storage temperature range - 65 to + 150 c tj maximum operating junction temperature * 150 c dv/dt critical rate of rise of reverse voltage 10000 v/ m s absolute ratings (limiting values) sma (jedec do-214ac) STPS1L40A * : dptot dtj < 1 rth ( j - a ) thermal runaway condition for a diode on its own heatsink 1/5
symbol parameter value unit r th (j-l) junction to lead sma 30 c/w smb 25 thermal resistances symbol tests conditions tests conditions min. typ. max. unit i r * reverse leakage current tj = 25 cv r = 40 v 35 m a tj = 125 c610ma v f * forward voltage drop tj = 25 ci f = 1 a 0.5 v tj = 125 c 0.37 0.42 tj = 25 ci f = 2 a 0.63 tj = 125c 0.5 0.61 static electrical characteristics pulse test : * tp = 380 m s, d < 2% to evaluate the maximum conduction losses use the following equation : p = 0.23 x i f(av) + 0.19 i f 2 (rms) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 if(av) (a) pf(av)(w) t d =tp/t tp d = 1 d = 0.5 d = 0.2 d = 0.1 d = 0.05 fig. 1: average forward power dissipation versus average forward current. 0 25 50 75 100 125 150 0.0 0.2 0.4 0.6 0.8 1.0 1.2 if(av)(a) rth(j-a)=rth(j-l) rth(j-a)=120c/w rth(j-a)=100c/w tamb(c) t d =tp/t tp fig. 2: average forward current versus ambient temperature ( d =0.5). 1e-3 1e-2 1e-1 1e+0 0 1 2 3 4 5 6 7 im(a) ta=25c ta=100c ta=50c t(s) i m t d =0.5 fig. 3-1: non repetitive surge peak forward cur- rent versus overload duration (maximum values) (smb). 1e-3 1e-2 1e-1 1e+0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 im(a) ta=25c ta=100c ta=50c t(s) i m t d =0.5 fig. 3-2: non repetitive surge peak forward cur- rent versus overload duration (maximum values) (sma). STPS1L40A/u 2/5
0 5 10 15 20 25 30 35 40 1e-3 1e-2 1e-1 1e+0 1e+1 2e+1 ir(ma) tj=100c tj=25c tj=150c vr(v) fig. 5: reverse leakage current versus reverse voltage applied (typical values). 12 51020 50 10 20 50 100 200 vr(v) c(pf) f=1mhz tj=25c fig. 6: junction capacitance versus reverse voltage applied (typical values). 0 100 200 300 400 500 600 700 800 900 1000 0.01 0.10 1.00 10.00 ifm(a) tj=125c tj=150c tj=25c vfm(mv) fig. 7-1: forward voltage drop versus forward cur- rent (typical values, high level). 1e-2 1e-1 1e+0 1e+1 1e+2 5e+2 0.0 0.2 0.4 0.6 0.8 1.0 tp(s) zth(j-a)/rth(j-a) t d =tp/t tp single pulse d = 0.5 d = 0.2 d = 0.1 fig. 4-1: relative variation of thermal impedance junction to ambient versus pulse duration (epoxy printed circuit board, e(cu)=35 m m, recommended pad layout) (smb). 1e-2 1e-1 1e+0 1e+1 1e+2 5e+2 0.0 0.2 0.4 0.6 0.8 1.0 tp(s) zth(j-a)/rth(j-a) t d =tp/t tp single pulse d = 0.5 d = 0.2 d = 0.1 fig. 4-2: relative variation of thermal impedance junction to ambient versus pulse duration (epoxy printed circuit board, e(cu)=35 m m, recommended pad layout) (sma). 0 100 200 300 400 500 600 700 800 0.0 0.5 1.0 1.5 2.0 2.5 3.0 ifm(a) tj=25c tj=125c tj=150c vfm(mv) fig. 7-2: forward voltage drop versus forward cur- rent (typical values, low level). STPS1L40A/u 3/5
package mechanical data sma foot print dimensions (in millimeters) 2.40 1.65 1.45 1.45 e c l e1 d a1 a2 b ref. dimensions millimeters inches min. max. min. max. a1 1.90 2.70 0.075 0.106 a2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.41 0.006 0.016 e 4.80 5.60 0.189 0.220 e1 3.95 4.60 0.156 0.181 d 2.25 2.95 0.089 0.116 l 0.75 1.60 0.030 0.063 012345 0 20 40 60 80 100 120 140 s(cu) (cm2) rth(j-a) (c/w) fig. 8-2: thermal resistance junction to ambient versus copper surface under each lead (epoxy printed circuit board fr4, copper thickness e(cu)= 35 m m) (sma). 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0 20 40 60 80 100 120 s(cu) (cm2) rth(j-a) (c/w) fig. 8-1: thermal resistance junction to ambient versus copper surface under each lead (epoxy printed circuit board fr4, copper thickness e(cu)= 35 m m) (smb). STPS1L40A/u 4/5
package mechanical data smb e c l e1 d a1 a2 b ref. dimensions millimeters inches min. max. min. max. a1 1.90 2.45 0.075 0.096 a2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.41 0.006 0.016 e 5.10 5.60 0.201 0.220 e1 4.05 4.60 0.159 0.181 d 3.30 3.95 0.130 0.156 l 0.75 1.60 0.030 0.063 1.52 2.75 2.3 1.52 foot print dimensions (in millimeters) information furnished is believed to be accurate and reliable. however, stmicroelectronics assumes no responsib ility for the cons equences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of stmicroelectronics. specifications mentioned in this publication are subject to change without notice. this publication supersedes and replaces all information previously supplied. stmicroelectronics products are not authorized for use as critical components in life support devices or systems without expres s written ap- proval of stmicroelectronics. the st logo is a registered trademark of stmicroelectronics ? 1999 stmicroelectronics - printed in italy - all rights reserved. stmicroelectronics group of companies australia - brazil - china - finland - france - germany - hong kong - india - italy - japan - malaysia malta - morocco - singapore - spain - sweden - switzerland - united kingdom - u.s.a. http://www.st.com ordering type marking package weight base qty delivery mode stps1l40u gc4 smb 0.107g 2500 tape & reel STPS1L40A gb4 sma 0.068g 5000 tape & reel band indicates cathode epoxy meets ul94,v0 STPS1L40A/u 5/5
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